1. 切割：晶圆级(wafer level)的除电(薄膜(film)剥离时.承载器(carrier)周边的除电)切割(dicing)装置内除电(薄膜(film)剥离时.承载器(carrier)周边的除电)封装(package)后搬运时的ESD对策安装机械(robot)运转部位内的除电DVD控制光头(
2. 切片：在过去三十年期间,切片(dicing)系统与刀片(blade)已经不断地改进以对付工艺的挑战和接纳不同类型基板的要求. 最新的、对生产率造成最大影响的设备进展包括:使两个切割(twocuts)同时进行的、将超程(overtravel)减到最小的双轴(dual-spindle)切片系统;
3. 芯片分割 (台)切片：Diazo Film 偶氮棕片 (台) 重氮底片 | Dicing 芯片分割 (台)切片 | Die Attach 晶粒安装 (台) 管芯安装
4. (切丁)：Grain-sized dicing (切粒) | Dicing (切丁) | Mincing (磨)
1. But for some gourmets, it's dicing with death that makes eating fugu such an attraction.
2. But lightly regulated financial outfits began slicing and dicing the resulting mortgages into securities and selling them to investors.